Definition

Ball Grid Array (BGA) is an integrated circuit package format where solder balls form the electrical connections between the chip and PCB. BGAs offer higher pin density than leaded packages, better thermal performance, and shorter signal paths. Common variants include PBGA (plastic), CBGA (ceramic), and CSP (chip-scale package). BGA pitch typically ranges from 0.4mm to 1.27mm, with fine-pitch BGAs requiring HDI PCB technology for escape routing.