Definition

BGA reballing removes the existing solder balls from a BGA package and attaches new balls, enabling component reuse or repair after removal from a PCB. The process involves cleaning old solder from the BGA pads, applying flux, placing new solder balls (using a stencil or preform), and reflowing to attach them. Reballing is used to salvage expensive components from failed boards, convert BGA ball alloy (leaded to lead-free or vice versa), or restore components after rework attempts. For PCB designers, reballing capability means expensive BGAs (FPGAs, processors) can potentially be recovered if boards fail during bring-up, reducing prototype costs. Not all BGAs are good candidates - moisture-sensitive components may be damaged by multiple reflow cycles.