Definition

Chip Scale Package (CSP) is a near-die-size package format, typically defined as no more than 1.2 times the size of the silicon die. CSPs use BGA-style solder ball connections with very fine pitch (0.4-0.5mm typical). They require HDI PCB technology with micro-vias for signal escape routing. CSPs offer excellent electrical performance due to short interconnect lengths and are common in mobile devices and high-density applications.