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PCB Glossary

PCB Glossary

depaneling

Also known as: singulation, board separation

Manufacturing Processes

Process of separating individual PCBs from a manufacturing panel after assembly.

Definition

Depaneling separates individual PCBs from the manufacturing panel after assembly is complete. Methods include V-score break (snap along pre-scored lines), routing (cutting with spinning router bit), punching/die cutting (stamping out boards), and laser cutting (for flex circuits or precision edges). Each method has trade-offs: V-score is fast but limited to straight edges with rough break lines; routing is flexible but slower and creates dust; laser is precise but expensive. For PCB designers, depaneling affects component placement - keep components at least 3mm from V-score lines to avoid stress damage, and 1mm from routed edges. Tall components near breakaway tabs may interfere with depaneling fixtures.

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