depaneling
Also known as: singulation, board separation
Manufacturing ProcessesProcess of separating individual PCBs from a manufacturing panel after assembly.
Definition
Depaneling separates individual PCBs from the manufacturing panel after assembly is complete. Methods include V-score break (snap along pre-scored lines), routing (cutting with spinning router bit), punching/die cutting (stamping out boards), and laser cutting (for flex circuits or precision edges). Each method has trade-offs: V-score is fast but limited to straight edges with rough break lines; routing is flexible but slower and creates dust; laser is precise but expensive. For PCB designers, depaneling affects component placement - keep components at least 3mm from V-score lines to avoid stress damage, and 1mm from routed edges. Tall components near breakaway tabs may interfere with depaneling fixtures.