Definition

Electroplating uses electric current to deposit metal ions from solution onto a conductive surface. In PCB fabrication, acid copper electroplating builds up copper thickness on traces and in via holes after electroless copper makes them conductive. Pattern plating deposits copper (then tin as etch resist) only on circuit features; panel plating coppers the entire panel first. Electroplating thickness varies with current density, requiring careful tank design and agitation for uniform deposition in high-aspect-ratio holes.