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PCB Glossary

PCB Glossary

ENIG

(Electroless Nickel Immersion Gold)
Acronyms & Abbreviations

Surface finish with nickel barrier and thin gold layer, providing flat pads and good shelf life.

Definition

Electroless Nickel Immersion Gold (ENIG) is a two-layer surface finish: 3-6 µm of electroless nickel topped with 0.05-0.1 µm of immersion gold. The nickel acts as a diffusion barrier while the gold protects against oxidation and provides solderability. ENIG offers excellent pad flatness (critical for fine-pitch BGAs), long shelf life (>12 months), and good wire bondability. It's lead-free and RoHS compliant. The main limitation is potential black pad defect from phosphorus enrichment.

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