Definition

Lamination bonds multiple PCB layers (cores and prepregs) into a solid multilayer structure using heat and pressure in a lamination press. The B-stage resin in prepregs flows and cures, permanently joining the layers. Critical parameters include temperature profile, pressure, and time. Lamination voids, delamination, and resin starvation are common defects. Controlled-depth drilling for buried vias requires lamination of sub-composites before final stack-up. High-layer-count boards may use sequential lamination with multiple press cycles.