Definition

Sequential lamination involves multiple press cycles to build up a PCB, enabling buried vias and complex HDI structures. First, inner sub-composites are fabricated with their own vias and circuits. These are then laminated together with additional prepreg and foil, followed by outer layer processing. Each cycle adds cost and time but enables structures impossible with single lamination. High-layer-count boards may require 3-4 lamination sequences. Process control of registration and z-axis expansion is critical.