Definition

Solderability measures how well solder wets and bonds to a surface. Good solderability requires: clean surface (no oxides, contamination), appropriate surface finish, and correct flux/temperature. Surface finishes degrade over time - OSP lasts 6 months, ENIG 12+ months. Testing per IPC J-STD-003 verifies solderability before assembly. Poor solderability causes dewetting, non-wetting, and unreliable joints. Factors affecting solderability: surface finish type, storage conditions, contamination, and intermetallic formation. Baking boards before assembly removes absorbed moisture that causes solderability problems.