Definition

High-power components require heat dissipation paths designed into the PCB. Effective strategies include: thermal via arrays under QFNs and BGAs (0.3mm vias on 0.6mm pitch reduce junction temperature by 20-40°C), 2oz copper planes that spread heat 50% more effectively than 1oz, and metal-core substrates for LED and power applications. When designing for thermal performance, specify heavy copper (2-4 oz) on inner layers connecting to thermal pads. For extreme cases (>5W per component), consider aluminum-backed or copper-core PCBs. Thermal simulation before fabrication identifies hot spots that can cause field failures.