The Problem: Surface-Mount Limits Z-Height and Trace Length
Surface-mount components sit on top of the PCB, consuming vertical space and requiring traces to travel up through vias, across the surface, and back down. In height-constrained products like wearables, implants, and ultra-thin devices, this becomes a hard limit. In high-speed designs, the extra trace length degrades signal integrity.
Embedded component technology solves both problems by placing active devices directly inside the PCB layers—eliminating package height and dramatically shortening signal paths.
How Embedded Components Work
Active electronic components can be embedded directly into PCB inner layers, eliminating surface-mount assembly for specific components. Shipco has been developing and refining this technology since 2002, with several patents granted for our processes.
Key Benefits
Compact Design
Embedding components inside the PCB layers eliminates the height of surface-mount packages. This enables thinner products and frees board surface area for other components or routing.
Shorter Signal Paths
With the component inside the board rather than on top, trace lengths to surrounding circuitry are reduced. This improves signal integrity and reduces parasitic inductance.
Noise Reduction
Embedded active components can be completely shielded by surrounding copper layers, reducing electromagnetic interference both to and from the component.
Higher Signal Integrity
Fewer via holes and shorter interconnects mean less signal degradation—particularly important for high-speed designs where every millimeter of trace length matters.
How It Works
The simplest implementation embeds an SMT chip in a multilayer PCB:
- The component is placed in a cavity or pocket in the inner layers
- Connections are made via through-hole vias to standard SMT leads, or laser-drilled micro-vias to component pads
- The connection is formed chemically, then electroplated—no solder required
This solder-free assembly approach provides reliable connections that can withstand repeated thermal cycling.
Requirements: Well-tested and in-circuit fully protected components must be used, since the embedded component cannot be replaced after lamination.
Production Examples
Here are microsection images from production boards manufactured at our facility in Ireland:
Flip chip embedded in a PCB and connected to micro-vias
Flip chip with staggered micro-via interconnections
Multiple embedded components in the same board—flip chip alongside other devices
Cross-section showing embedded component within the PCB stackup
Through-hole connections to an embedded component
Thermal management: through-holes provide heat dissipation path for embedded component
When to Consider Embedded Components
This technology makes sense when:
- Height is constrained — the product requires minimal Z-height
- Signal integrity is critical — high-speed designs benefit from shorter traces
- Shielding is required — sensitive circuits need complete electromagnetic isolation
- Reliability is paramount — solder-free connections eliminate a common failure mode
This technology is available today and requires no re-tooling for existing PCB manufacturing processes.
Related Articles
- Embedded Resistors in PCBs – Passive resistor embedding with Ohmega-Ply
- Embedded Capacitors in PCBs – Capacitor embedding techniques
- Embedded Capacitance Layers – Power plane configurations
- Micro-Via Advantages in PCBs – HDI routing for embedded designs
Manufacturing Note
Embedded component technology requires specialized manufacturing capabilities that are not widely available. While Shipco has extensive experience with this technology dating back to 2002, finding qualified suppliers for production can be challenging. We can provide design guidance and help evaluate feasibility for your specific application. If you’re considering embedded components, contact us early in your design process to discuss manufacturability and sourcing options.
Interested in embedded component technology? Contact us to discuss your application and explore what’s feasible.