PCB Designer’s Tips
This guide covers the essential information needed for PCB quotes, factors that affect manufacturing cost, panel optimization for better yield, and common industry abbreviations. Use it to communicate requirements efficiently and make informed design trade-offs.
Getting Quotes Faster
Every PCB quote requires the same information: layer count, thickness, materials, copper weights, finishes, tolerances. Missing information delays quotes while we ask clarifying questions.
Standard Specifications
To avoid listing PCB parameters repeatedly, we support standard type shorthand. The basic standard type is the most commonly ordered PCB type: 2 layer, min 1 oz copper, PTH, 1.6 mm thick, FR4, solder mask green x2, silk screen white x1, ENIG finish, min trace and gap 5 mil, IPC Class 2.
You are welcome to specify Std, Std_4L, or Std_6L_0.8mm etc. and list only non-standard parameters. Example: Std with 2.4 mm FR4 Tg135 and silk screen 2 sides, solder mask blue.
Otherwise necessary information to quote:
- Copper thickness - Inner and outer layers
- Total thickness - and required tolerance
- ML-build - minimum isolation between layers
- Materials - types, thicknesses
- Drill dimension table - Number of holes and dimensions (in gerbers)
- Complete drawing - Gerber outline and tolerances
- Solder surface finish - Solder surface
- Type of solder mask - Color, 1 or 2 side
- Type of legend print - Color, 1 or 2 side
- Net list - IPC 356 are preferred
Design Checklist
- Separate plated and unplated holes into different drill files
- Name and number layers in order (1 to N). Add text on outer layers to prevent mirroring errors
- Add solder mask openings for unplated holes
- Specify via fill requirements: solder mask only, or resin via fill?
- Remove unused traces, or note if they are intentional guard traces
- Verify clearance around plated and unplated holes on inner layers
Factors Affecting Cost
- Quantity - Total batch area determines pricing tier
- Lead time - Standard is 15 working days; faster delivery costs more
- Board size - Larger, complex boards have higher per-area cost
- Materials - FR-4 Tg130 is lowest cost; high-Tg, Rogers, polyimide cost more
- IPC Class - Class III costs more than Class II
- Trace/space - Below 0.15 mm (6 mil) increases cost
- Layer count - More layers = higher cost
- Thickness - Non-standard thickness affects laminate and drilling
- Hole count and size - More holes and holes below 0.5 mm increase cost
- Test points - More test points = higher testing cost
- Surface finish - HASL is cheapest; ENIG, hard gold cost more
- Blind/buried vias - Additional lamination cycles increase cost
- Microvias - May increase or decrease cost depending on design
- Special processes - Carbon print, peelable mask, edge plating add cost
Panel Optimization
How boards are arranged on a production panel significantly affects price. Higher utilization means more boards per panel, lower cost per board, and less material waste.
The example below shows how the same board dimensions can yield 3 to 6 pieces from a panel depending on layout. Panels with 7-12 mm rails on two or more sides typically provide good yield with no assembly problems.
We suggest panel layouts to customers regularly - just ask.
Abbreviations
| Abbreviation | Meaning |
|---|---|
| AOI | Automatic Optic Inspection |
| BGA | Ball Grid Array |
| BT | Bismaleimide Triazine (BT-Epoxy) |
| CAD | Computer Aided Design |
| CAF | Conductive Anodic Filament |
| CAM | Computer Aided Manufacturing |
| CSP | Chip Scale Package |
| CTE | Coefficient of Thermal Expansion |
| Df | Dissipation factor |
| Dk | Dielectric constant |
| DRC | Design Rule Check |
| ENIG | Electroless Nickel Immersion Gold |
| ENEPIG | Electroless Nickel Electroless Palladium Immersion Gold |
| FR-4 | Flame Resistant 4 |
| HASL | Hot Air Solder Leveling |
| HASL Pb Free | Hot Air Solder Leveling Lead Free |
| HDI | High Density Interconnect |
| I/O | Input/Output |
| IPC | International Printed Circuit Association (PCB/PCBA standards) |
| IR | Infra Red |
| MCM | Multi Chip Module |
| NPTH | Non Plated Through Hole |
| OSP | Organic Solderability Preservatives |
| PCB | Printed Circuit Board |
| PTH | Plated Through Hole |
| PTFE | Polytetrafluoroethylene (Teflon) |
| PWB | Printed Wiring Board |
| QFP | Quad Flat Pack |
| RCC | Resin Coated Copper |
| RoHS | Restriction of Hazardous Substances |
| SMD | Surface Mount Device |
| SMT | Surface Mount Technology |
| SMOBC | Solder Mask Over Bare Copper |
| Tg | Glass transition temperature (when epoxy softens) |
| UL | Underwriter’s Laboratories |
| UV | Ultra Violet |
Frequently Asked Questions
What information do I need for a PCB quote?
At minimum: layer count, board thickness, copper weight (inner and outer), materials, surface finish, solder mask color, and drill files with hole dimensions. For multilayer boards, also include the stackup with isolation requirements between layers.
What is a standard PCB specification?
Our standard spec (Std) is: 2-layer, 1 oz copper, PTH, 1.6 mm FR-4, green solder mask both sides, white silkscreen one side, ENIG finish, 5 mil trace/space, IPC Class 2. Reference this as a baseline and list only deviations.
How can I reduce PCB manufacturing cost?
Use standard materials (FR-4 Tg130), standard thickness (1.6 mm), HASL finish, and avoid features like blind/buried vias, tight trace/space, or small holes unless necessary. Optimize panel utilization and allow standard lead times.
What file formats do you accept?
Gerber (RS-274X), ODB++, or IPC-2581. Include drill files (Excellon), netlists (IPC-356 preferred), and a fabrication drawing with the stackup, tolerances, and special requirements.
Related Articles
- Multilayer PCB Capabilities - Detailed manufacturing specifications
- PCB Materials and Laminates Guide - Material selection and properties
- How Multilayer PCBs Are Made - Understanding the fabrication process
- PCB Build Illustrations - Visual reference for stackup configurations
Need design guidance? Contact us - our engineers review designs at no charge before quoting.